芯       片：
平膜/隔膜感压防堵结构设计，适用于熔体/流体介质；
采用进口感压芯片；选进的贴片工艺；
高阻抗、高精度、高稳定性；
膜片结构：厚膜型压阻式、溥膜型硅芯片、法兰型大膜片；
100万次使用寿命以上；

信号处理及输出：
24位ADC采样处理芯片；
DSP数字信号调理算法；
多点性线温度校准；
电压电流过载保护；
标准工业信号输出：4-20mA(二线制)，0-20mA(三线制)，0-5VDC，0-10VDC，0.5-4.5VDC(三线制);
数字通讯信号输出：RS485-RTU、超低功耗RS485-RTU
采用先进的32bit微处理器和24bit ADC
传输协议采用通用的MODBUS-RTU协议
支持波特率：1200~57600bps，校验位：NONE、ODD、EVEN
支持用户二次校准、清零、反清零、恢复出厂等操作
支持11种单位切换，支持浮点型、整型、百分比、格式化输出
采集间隔0~43200秒(12小时)可设，既可连续采集，满足高速采集的场合，也可单次触发采集，最大限度降低功耗

结       构：
厚膜结构：深度氩弧焊接，连接弹性材料与过程接头，强度高，抗冲击，耐疲劳；
溥膜结构：激光焊接，连接弹性材料与过程接头，硅油介质传递压力，响应快，耐疲劳，小量程；
整体结构小巧，过程连接方式多样化（M20X1.5,G1/2 ,ZG1/2,1/2NPT(螺纹小径≥17mm)DN50等）；
过程连接材料：304或316；

应      用：
熔体/流体/粘稠性介质压力测量与控制；
工业/电力/石油/自动化等领域的设备压力测量


Chip:
Flat film / diaphragm pressure sensing and anti blocking structure design, suitable for melt / fluid medium;
Adopt imported pressure sensitive chip; select the chip technology;
High impedance, high precision and high stability;
Diaphragm structure: thick film piezoresistive, thin film silicon chip, flange type large diaphragm;
More than 1 million service life;

Signal processing and output:
24 bit ADC sampling processing chip;
DSP digital signal conditioning algorithm;
Multipoint line temperature calibration;
Voltage and current overload protection;
Standard industrial signal output: 4-20mA (two-wire system), 0-20mA (three wire system), 0-5vdc, 0-10vdc, 0.5-4.5vdc (three wire system);
Digital communication signal output: rs485-rtu, ultra-low power rs485-rtu
Advanced 32bit microprocessor and 24bit ADC
The transmission protocol adopts the general MODBUS-RTU protocol
Support baud rate: 1200 ~ 57600bps, check bit: none, odd, even
It supports the user's secondary calibration, clearing, anti clearing, factory restoration and other operations
Supports 11 unit switches, floating point, integer, percentage, format output
The acquisition interval of 0-43200 seconds (12 hours) can be set, which can not only continuously acquire, but also meet the occasion of high-speed acquisition, and can trigger acquisition once, minimizing power consumption

Structure:
Thick film structure: deep argon arc welding, connecting elastic material and process joint, high strength, impact resistance, fatigue resistance;
Thin film structure: laser welding, connecting elastic materials and process joints, silicon oil medium transfer pressure, fast response, fatigue resistance, small range;
The overall structure is small and the process connection mode is diversified (m20x1.5, G1 / 2, ZG1 / 2, 1 / 2NPT (thread diameter ≥ 17mm) DN50, etc.);
Process connection material: 304 or 316;

Application:
Melt / fluid / viscous medium pressure measurement and control;
Equipment pressure measurement in industry / power / oil / automation and other fields

输出信号：

电流型：4～20mA二线制；4～20mA/0-20mA三线制

供电电压：

24VDC(9～30VDC)

3.1～6.1VDC（低功耗RS485-RTU）

五、安装方式