芯 片:
平膜/隔膜感压防堵结构设计,适用于熔体/流体介质;
采用进口感压芯片;选进的贴片工艺;
高阻抗、高精度、高稳定性;
膜片结构:厚膜型压阻式、溥膜型硅芯片、法兰型大膜片;
100万次使用寿命以上;
信号处理及输出:
24位ADC采样处理芯片;
DSP数字信号调理算法;
多点性线温度校准;
电压电流过载保护;
标准工业信号输出:4-20mA(二线制),0-20mA(三线制),0-5VDC,0-10VDC,0.5-4.5VDC(三线制);
数字通讯信号输出:RS485-RTU、超低功耗RS485-RTU
采用先进的32bit微处理器和24bit ADC
传输协议采用通用的MODBUS-RTU协议
支持波特率:1200~57600bps,校验位:NONE、ODD、EVEN
支持用户二次校准、清零、反清零、恢复出厂等操作
支持11种单位切换,支持浮点型、整型、百分比、格式化输出
采集间隔0~43200秒(12小时)可设,既可连续采集,满足高速采集的场合,也可单次触发采集,最大限度降低功耗
结 构:
厚膜结构:深度氩弧焊接,连接弹性材料与过程接头,强度高,抗冲击,耐疲劳;
溥膜结构:激光焊接,连接弹性材料与过程接头,硅油介质传递压力,响应快,耐疲劳,小量程;
工业级2088铸铝合金防爆壳体,强度可靠坚固;
整体结构小巧,过程连接方式多样化(M20X1.5,G1/2 ,ZG1/2,1/2NPT(螺纹小径≥17mm)DN50等);
过程连接材料:304或316;
应 用:
熔体/流体/粘稠性介质压力测量与控制;
工业/电力/石油/自动化等领域的设备压力测量
Chip:
Flat film / diaphragm pressure sensing and anti blocking structure design, suitable for melt / fluid medium;
Adopt imported pressure sensitive chip; select the chip technology;
High impedance, high precision and high stability;
Diaphragm structure: thick film piezoresistive, thin film silicon chip, flange type large diaphragm;
More than 1 million service life;
Signal processing and output:
24 bit ADC sampling processing chip;
DSP digital signal conditioning algorithm;
Multipoint line temperature calibration;
Voltage and current overload protection;
Standard industrial signal output: 4-20mA (two-wire system), 0-20mA (three wire system), 0-5vdc, 0-10vdc, 0.5-4.5vdc (three wire system);
Digital communication signal output: rs485-rtu, ultra-low power rs485-rtu
Advanced 32bit microprocessor and 24bit ADC
The transmission protocol adopts the general MODBUS-RTU protocol
Support baud rate: 1200 ~ 57600bps, check bit: none, odd, even
It supports the user's secondary calibration, clearing, anti clearing, factory restoration and other operations
Supports 11 unit switches, floating point, integer, percentage, format output
The acquisition interval of 0-43200 seconds (12 hours) can be set, which can not only continuously acquire, but also meet the occasion of high-speed acquisition, and
can trigger acquisition once, minimizing power consumption
Structure:
Thick film structure: deep argon arc welding, connecting elastic material and process joint, high strength, impact resistance, fatigue resistance;
Thin film structure: laser welding, connecting elastic materials and process joints, silicon oil medium transfer pressure, fast response, fatigue resistance, small
range;
Industrial grade 2088 cast aluminum alloy explosion-proof shell, reliable and solid strength;
The overall structure is small and the process connection mode is diversified (m20x1.5, G1 / 2, ZG1 / 2, 1 / 2NPT (thread diameter ≥ 17mm) DN50, etc.);
Process connection material: 304 or 316;
Application:
Melt / fluid / viscous medium pressure measurement and control;
Equipment pressure measurement in industry / power / oil / automation and other fields
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